Secure Packaging of Chiplets: Emerging Trends of Silicon Life Cycle in Common Criteria (A13b)
IC System Security – Japan Consortium (ICSS-JC) with 15-year experience of IC chip CC evaluation has become an Associate Member of EUCC ISAC and faces a new challenge, namely secure packaging of chiplets. the presenters, a member of ICSS-JC, will examine how the assurance scope must be expanded to a broader ecosystem including OSATs. the presenters introduce a method for updating silicon life cycle in PP-0084 protection profile from a composable perspective, illustrated with secure packaging Si examples. In this way, the presenters expect to address structural and physical security of chiplets at an earlier phase of this updated lifecyle.