19-20 October 2021 | Virtual Conference and Vendor Showcase

Jean-Philippe Galvan

Principal Engineer, Qualcomm, Vice-Chairman, Eurosmart ITSC

Jean-Philippe Galvan

Principal Engineer, Qualcomm, Vice-Chairman, Eurosmart ITSC

Biography

Jean-Philippe Galvan has been involved in embedded security for almost 20 years. Jean-Philippe works for Qualcomm Technologies, Inc. where he is participating in definition, architecture and certification of Qualcomm’s Secure Processing Unit, an integrated secure element to protect SIM, identity, biometrics and payment. Prior to Qualcomm, he worked for Texas Instruments, Samsung, Inside Secure and TrustAZUR. Jean-Philippe is actively representing Qualcomm in several standard bodies and committees, and particularly at Eurosmart where he co-chairs ITSC committee. He also served at GlobalPlatform as co-chair of the Device Committee and leader of the TEE Roadmap Working Group, and he received two Star Awards in 2010 and 2015.

Presentations by Jean-Philippe Galvan